3,5" Motherboard
Kaby Lake
CAPA500
- 3.5 Zoll Embedded Motherboard mit 6./7. Generation Intel® Core™ i7/i5/i3 Prozessor
- LVDS/ VGA/HDMI
- Dual LANs und Audio
- 6./7. Generation Intel® Core™ i7/i5/i3 Prozessor (Skylake/Kaby Lake)
- Intel® H110 Chipsatz (Q170 optional)
- 1 DDR4-1867 SO-DIMM mit bis zu 16GB
- 3 USB 3.0 und 3 USB 2.0 Anschlüsse
- 1 COM Anschluss
- unterstützt Intel® AMT 11 (optional)
| CPU | LGA1151 socket for 7th/6th gen Intel® Core™ i7/i5/i3 processor (TDP=35W only) | ||||||||||||||
| System Memory | 1 x 260-pin DDR4-2400 SO-DIMM, up to 16GB | ||||||||||||||
| Chipset | Intel® H110 Intel® Q170 (optional) | ||||||||||||||
| BIOS | AMI | ||||||||||||||
| SSD | N/A | ||||||||||||||
| Watchdog Timer | 255 levels, 1 to 255 sec. | ||||||||||||||
| Expansion Interface | 1 x Full-size PCI Express Mini Card slot with mSATA supported 1 x USB, 1 x PCIe x1, 1 x LPC, 1 x SMBus through a ZIO connector (optional) | ||||||||||||||
| Battery Lithium | Lithium 3V/220mAH | ||||||||||||||
| Power Input | 2 x 2-pin connector +12V DC-in only AT Auto Power On function supported | ||||||||||||||
| Dimensions | 146 x 104 mm | ||||||||||||||
| Board Thickness | 1.6 mm | ||||||||||||||
| Operating Temperature | -20°C to +60°C (-4°F to +140°F) | ||||||||||||||
| Humidity | 10% to 95% relative humidity, non-condensing | ||||||||||||||
- CAPA500VHGGA-H110 (P/N-E38E500103)
3.5″ embedded SBC with LGA1151 socket 6th/7th generation Intel® Core™ i7/i5/i3 processor, Intel® H110 chipset, VGA/LVDS/HDMI, 2 GbE LANs, audio and gift box
- CAPA500VHGGA-Q170 (P/N-E38E500102)
3.5″ embedded SBC with LGA1151 socket 6th/7th generation Intel® Core™ i7/i5/i3 processor, Intel® Q170 chipset, VGA/LVDS/HDMI, 2 GbE LANs, audio and gift box
- CAPA500VHGGA-H110-ZI0 (P/N- E38E500101)
3.5″ embedded SBC with LGA1151 socket 6th/7th generation Intel® Core™ i7/i5/i3 processor, Intel® H110 chipset, VGA/LVDS/HDMI, 2 GbE LANs, audio and ZIO connector
- CAPA500VHGGA-Q170-ZI0 (P/N-E38E500100)
3.5″ embedded SBC with LGA1151 socket 6th/7th generation Intel® Core™ i7/i5/i3 processor, Intel® Q170 chipset, VGA/LVDS/HDMI, 2 GbE LANs, audio and ZIO connector
- AX93262 (P/N-E393262100)
ZIO module for 2 x RS-232/422/485, 2 x RS-232, 1 x PCI Express Mini Card slot
- AX93285 (P/N-E393285100)
ZIO module for 2 x RS-232, 32-bit programmable DIO
- AX93291 (P/N-E393291100)
ZIO module for 2 x RS-232, 2 x GbE LAN
- AX93295 (P/N-E393295100)
ZIO module for 2 x isolated RS-232, 2 x USB 3.0
- 6./7. Generation Intel® Core™ i7/i5/i3 Prozessor (Skylake/Kaby Lake)
- Intel® H110 Chipsatz (Q170 optional)
- 1 DDR4-1867 SO-DIMM mit bis zu 16GB
- 3 USB 3.0 und 3 USB 2.0 Anschlüsse
- 1 COM Anschluss
- unterstützt Intel® AMT 11 (optional)
| CPU | LGA1151 socket for 7th/6th gen Intel® Core™ i7/i5/i3 processor (TDP=35W only) | ||||||||||||||
| System Memory | 1 x 260-pin DDR4-2400 SO-DIMM, up to 16GB | ||||||||||||||
| Chipset | Intel® H110 Intel® Q170 (optional) | ||||||||||||||
| BIOS | AMI | ||||||||||||||
| SSD | N/A | ||||||||||||||
| Watchdog Timer | 255 levels, 1 to 255 sec. | ||||||||||||||
| Expansion Interface | 1 x Full-size PCI Express Mini Card slot with mSATA supported 1 x USB, 1 x PCIe x1, 1 x LPC, 1 x SMBus through a ZIO connector (optional) | ||||||||||||||
| Battery Lithium | Lithium 3V/220mAH | ||||||||||||||
| Power Input | 2 x 2-pin connector +12V DC-in only AT Auto Power On function supported | ||||||||||||||
| Dimensions | 146 x 104 mm | ||||||||||||||
| Board Thickness | 1.6 mm | ||||||||||||||
| Operating Temperature | -20°C to +60°C (-4°F to +140°F) | ||||||||||||||
| Humidity | 10% to 95% relative humidity, non-condensing | ||||||||||||||
- CAPA500VHGGA-H110 (P/N-E38E500103)
3.5″ embedded SBC with LGA1151 socket 6th/7th generation Intel® Core™ i7/i5/i3 processor, Intel® H110 chipset, VGA/LVDS/HDMI, 2 GbE LANs, audio and gift box
- CAPA500VHGGA-Q170 (P/N-E38E500102)
3.5″ embedded SBC with LGA1151 socket 6th/7th generation Intel® Core™ i7/i5/i3 processor, Intel® Q170 chipset, VGA/LVDS/HDMI, 2 GbE LANs, audio and gift box
- CAPA500VHGGA-H110-ZI0 (P/N- E38E500101)
3.5″ embedded SBC with LGA1151 socket 6th/7th generation Intel® Core™ i7/i5/i3 processor, Intel® H110 chipset, VGA/LVDS/HDMI, 2 GbE LANs, audio and ZIO connector
- CAPA500VHGGA-Q170-ZI0 (P/N-E38E500100)
3.5″ embedded SBC with LGA1151 socket 6th/7th generation Intel® Core™ i7/i5/i3 processor, Intel® Q170 chipset, VGA/LVDS/HDMI, 2 GbE LANs, audio and ZIO connector
- AX93262 (P/N-E393262100)
ZIO module for 2 x RS-232/422/485, 2 x RS-232, 1 x PCI Express Mini Card slot
- AX93285 (P/N-E393285100)
ZIO module for 2 x RS-232, 32-bit programmable DIO
- AX93291 (P/N-E393291100)
ZIO module for 2 x RS-232, 2 x GbE LAN
- AX93295 (P/N-E393295100)
ZIO module for 2 x isolated RS-232, 2 x USB 3.0
Passende Anwendungsbeispiele
