Kontakt

Hotline

+49 (0)2173 39936-0

E-Mail

Natürlich haben Sie auch die Möglichkeit ganz einfach und bequem unser Kontaktformular zu nutzen

Zum Kontaktformular

Anschrift

  • AXIOMTEK DEUTSCHLAND GmbH
  • Hans-Böckler-Straße 10
  • 40764 Langenfeld
  • MO-DO: 08:30 bis 17:00 Uhr
  • FR: 8:30 bis 15:00 Uhr
bg article
bg dashed article
bg dashed article
bg dashed article

Lüfterloser Embedded PC

Coffee Lake-S

eBOX671-521-FL

  • Lüfterloses Embedded System
  • mit LGA1151-Sockel 8./9. Generation Intel® Core™ i7/i5/i3 & Celeron® Prozessoren
  • 4-CH PoE und MXM Grafik-Modul
Jetzt Produkt anfragen
Features
  • 8./9. Generation Intel® Core™ i7/i5/i3 & Celeron® mit Intel® Q370
  • 4-CH GbE PoE (IEEE802.3at)
  • Dual austauschbares 2.5″ SATA HDD Drive Bay
  • ECC Speicher unterstützt durch Intel® C246 (optional)
  • Unterstützt MXM Grafik-Module (optional)
  • DVI-I, HDMI, und DisplayPort mit Triple-View unterstützt
  • AXView 2.0 intelligente Software zur Überwachung im IIoT-Anwendungsbereich
Spezifikationen
CPU
  • LGA1151 9th/8th gen Intel® Core™ i7/i5/i3 & Celeron®
  • processors (35W/65W)
Chipset
  • Intel® Q370
  • Intel® C246 PCH (optional)
System Memory
  • 2 x 260-pin DDR4-2666 SO-DIMM, up to 64GB (ECC supported by Intel® C246 PCH)
BIOS
  • AMI
COM
  • 2 x RS-232/422/485
USB
  • 4 x USB 3.1 Gen2
  • 2 x USB 3.1 Gen1
Ethernet/PoE
  • 2 x 10/100/1000 Mbps (Intel® i210-IT & i219-LM)
  • 4 x Power over Ethernet (IEEE802.2at), up to 60W
Display
  • 2 x DisplayPort via optional MXM kit
  • 1 x HDMI
  • 1 x DisplayPort
  • 1 x DVI-I
Digital I/O
  • N/A
Audio
  • N/A
Storage
  • 2 x 2.5″ HDD drive bay (max. up 9.5 mm height)
  • 1 x mSATA (enabled in BIOS setting)
Expansion
  • 2 x Full-size PCI Express Mini Card slot (USB + PCIe signal)
  • 2 x SIM slot
  • 1 x Internal MXM 3.1 type A connector
Others
  • 1 x Flexible I/O window (Default : 2 x DB9 half cut bracket)
  • 4 x SMA-type antenna connector
  • TPM 2.0
Power Supply
  • 24 VDC
Watchdog Timer
  • 255 levels, 1 to 255 sec.
Construction
  • Aluminum extrusion and heavy-duty steel, IP40
Operating Temperature
  • Without MXM module:
    -40°C to 60°C (-40°F to +140°F) (with W.T. DRAM & SSD, CPU TDP 35W)
    -40°C to 50°C (-40°F to +122°F) (with W.T. DRAM & SSD, CPU TDP 65W)
  • With MXM module:
    -40°C to 50°C (-40°F to +122°F) (with W.T. DRAM & SSD & MXM Kit, CPU TDP 35W)
Relative Humidity
  • 10% to 90%, non-condensing
Shock
  • IEC 60068-2-27 (w/SSD: 50G@wall mount,half sine, 11 ms duration)
Vibration
  • IEC 60068-2-64 (w/SSD: 3Grms STD, random, 5 – 500 Hz, 1 hr/axis)
Dimensions
(W x D x H)
  • 280 x 210 x 80.5 mm (11.02″ x 8.26″ x 3.16″)
Weight (net/gross)
  • 4.8 kg (10.58 lb)/5.6 kg (12.34 lb)
Certifications
  • CE, FCC Class A
EOS Support
  • Win 10 IoT, Linux
Software Support
  • AXView 3.0
Mounting
  • Wall mount kit
  • DIN-rail kit
Bestellinformationen
  • eBOX671-521-FL-DC-4PoE Fanless embedded system with LGA1151 9th/8th gen Intel® Core™ i7/i5/i3 & Celeron® processor, Intel® Q370, DVI-I, HDMI, dual HDD, 4 PoE, 2 GbE LAN, 6 USB, 2 COM and 24 VDC
  • eBOX671-521-FL-DC-6GbE Fanless embedded system with LGA1151 9th/8th gen Intel® Core™ i7/i5/i3 & Celeron® processor, Intel® Q370, DVI-I, HDMI, dual HDD, 6 GbE LAN, 6 USB, 2 COM and 24 VDC
  • 2.5” SATA HDD 80GB or above
  • 2.5” SATA SSD 100GB or above
  • DDR4 SO-DIMM 4GB to 32GB
  • mSATA 64GB or above
  • 8816K6718A0E Wall mount kit
  • 8816K6719A0E DIN-rail kit
  • 8816K6603A0E Wi-Fi module
  • 3G/LTE module
  • MXM 3.1 Type A module
  • 50906D24000E 24V, 120W adapter
  • AX92903 (E392903102) CANbus PCI Express Mini module
  • AX92903 (E392903103) CAN module with CANOpen
  • AX92902 (E392902103) LAN PCI Express Mini module
  • 59406392140E RS-232 cable, L=200 mm for COM3/4
  • AX92904 (E392904102) DIO PCI Express Mini module
Downloads
Datenblatt:
14.11.2019
PDF
217 KB
CE-Zertifikate:
28.05.2019
PDF
97 KB
Quick Manual:
24.05.2019
PDF
357 KB
User Manual:
26.06.2019
PDF
1 MB
Features
  • 8./9. Generation Intel® Core™ i7/i5/i3 & Celeron® mit Intel® Q370
  • 4-CH GbE PoE (IEEE802.3at)
  • Dual austauschbares 2.5″ SATA HDD Drive Bay
  • ECC Speicher unterstützt durch Intel® C246 (optional)
  • Unterstützt MXM Grafik-Module (optional)
  • DVI-I, HDMI, und DisplayPort mit Triple-View unterstützt
  • AXView 2.0 intelligente Software zur Überwachung im IIoT-Anwendungsbereich
Spezifikationen
CPU
  • LGA1151 9th/8th gen Intel® Core™ i7/i5/i3 & Celeron®
  • processors (35W/65W)
Chipset
  • Intel® Q370
  • Intel® C246 PCH (optional)
System Memory
  • 2 x 260-pin DDR4-2666 SO-DIMM, up to 64GB (ECC supported by Intel® C246 PCH)
BIOS
  • AMI
COM
  • 2 x RS-232/422/485
USB
  • 4 x USB 3.1 Gen2
  • 2 x USB 3.1 Gen1
Ethernet/PoE
  • 2 x 10/100/1000 Mbps (Intel® i210-IT & i219-LM)
  • 4 x Power over Ethernet (IEEE802.2at), up to 60W
Display
  • 2 x DisplayPort via optional MXM kit
  • 1 x HDMI
  • 1 x DisplayPort
  • 1 x DVI-I
Digital I/O
  • N/A
Audio
  • N/A
Storage
  • 2 x 2.5″ HDD drive bay (max. up 9.5 mm height)
  • 1 x mSATA (enabled in BIOS setting)
Expansion
  • 2 x Full-size PCI Express Mini Card slot (USB + PCIe signal)
  • 2 x SIM slot
  • 1 x Internal MXM 3.1 type A connector
Others
  • 1 x Flexible I/O window (Default : 2 x DB9 half cut bracket)
  • 4 x SMA-type antenna connector
  • TPM 2.0
Power Supply
  • 24 VDC
Watchdog Timer
  • 255 levels, 1 to 255 sec.
Construction
  • Aluminum extrusion and heavy-duty steel, IP40
Operating Temperature
  • Without MXM module:
    -40°C to 60°C (-40°F to +140°F) (with W.T. DRAM & SSD, CPU TDP 35W)
    -40°C to 50°C (-40°F to +122°F) (with W.T. DRAM & SSD, CPU TDP 65W)
  • With MXM module:
    -40°C to 50°C (-40°F to +122°F) (with W.T. DRAM & SSD & MXM Kit, CPU TDP 35W)
Relative Humidity
  • 10% to 90%, non-condensing
Shock
  • IEC 60068-2-27 (w/SSD: 50G@wall mount,half sine, 11 ms duration)
Vibration
  • IEC 60068-2-64 (w/SSD: 3Grms STD, random, 5 – 500 Hz, 1 hr/axis)
Dimensions
(W x D x H)
  • 280 x 210 x 80.5 mm (11.02″ x 8.26″ x 3.16″)
Weight (net/gross)
  • 4.8 kg (10.58 lb)/5.6 kg (12.34 lb)
Certifications
  • CE, FCC Class A
EOS Support
  • Win 10 IoT, Linux
Software Support
  • AXView 3.0
Mounting
  • Wall mount kit
  • DIN-rail kit
Bestellinformationen
  • eBOX671-521-FL-DC-4PoE Fanless embedded system with LGA1151 9th/8th gen Intel® Core™ i7/i5/i3 & Celeron® processor, Intel® Q370, DVI-I, HDMI, dual HDD, 4 PoE, 2 GbE LAN, 6 USB, 2 COM and 24 VDC
  • eBOX671-521-FL-DC-6GbE Fanless embedded system with LGA1151 9th/8th gen Intel® Core™ i7/i5/i3 & Celeron® processor, Intel® Q370, DVI-I, HDMI, dual HDD, 6 GbE LAN, 6 USB, 2 COM and 24 VDC
  • 2.5” SATA HDD 80GB or above
  • 2.5” SATA SSD 100GB or above
  • DDR4 SO-DIMM 4GB to 32GB
  • mSATA 64GB or above
  • 8816K6718A0E Wall mount kit
  • 8816K6719A0E DIN-rail kit
  • 8816K6603A0E Wi-Fi module
  • 3G/LTE module
  • MXM 3.1 Type A module
  • 50906D24000E 24V, 120W adapter
  • AX92903 (E392903102) CANbus PCI Express Mini module
  • AX92903 (E392903103) CAN module with CANOpen
  • AX92902 (E392902103) LAN PCI Express Mini module
  • 59406392140E RS-232 cable, L=200 mm for COM3/4
  • AX92904 (E392904102) DIO PCI Express Mini module
Download
Datenblatt:
PDF
217 KB
CE-Manual:
PDF
97 KB
Quick Manual:
PDF
357 KB
User Manual:
PDF
1 MB

Passende Anwendungsbeispiele

Industrie 4.0
Industrie 4.0
Smart City
Smart City
CNC-Computer
CNC-Computer
Weitere Anwendungsbeispiele ansehen
Back To Top