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COM Express Typ 6 Modul

Coffee Lake

CEM520

  • COM Express Typ 6 Basis Modul mit Intel® Xeon® & 8th Gen Intel® Core™ Processoren
  • Intel® CM246/QM370/HM370
  •  2 DDR4-2666 SO-DIMM Slots für bis zu 32GB Speicher
Jetzt Produkt anfragen
Features
  • Intel® Xeon® & 8th gen Intel® Core™ i7/i5/i3 Proczessoren (Coffee Lake)
  • Intel® CM246/QM370/HM370 Chipset
  • 2 DDR4-2666 SO-DIMM Slots für bis zu 32GB Speicher
  • 1 PCIe x16 und 8 PCIe x1 Gen3
  • 4 SATA-600 mit RAID 0/1/5/10
  • 4 USB 3.0 mit 8 USB 2.0
  • TPM 2.0 Funktion unterstützt
  • AMS.AXView intelligente Fernverwaltungssoftware für industrielle IoT-Anwendungen
Spezifikationen
CPU
  • Intel® Xeon® & 8th gen Intel® Core™ i7/i5/i3 processors (Coffee Lake)
Chipset
  • Intel® CM246/QM370/HM370
System Memory
  • 2 x DDR4-2666 SO-DIMM, up to 32GB non-ECC/ECC memory
BIOS
  • AMI
Serial
  • 1 x LPC
  • 1 x SPI
  • 2 x TX/RX
USB
  • 4 x USB 3.0
  • 8 x USB 2.0
Ethernet
  • 1 x 10/100/1000 Mbps (Intel® i219-LM)
Display
  • 1 x LVDS (optional eDP 1.4: 4096 x 2304 @60Hz)
  • 1 x VGA; up to 1920 x 1200 @60Hz (default)
  • 2 x DDI (DisplayPort 1.2: 4096 x 2304 @60Hz/HDMI 1.4: 4096 x 2160 @30/24Hz)
GPIO
  • 4-CH in & 4-CH out
Audio
  • HD link interface to baseboard for Codec
Storage
  • 4 x SATA-600 with RAID 0/1/5/10
Expansion
  • 1 x PCIe x16 Gen3
  • 8 x PCIe x1 Gen3
Others
  • 1 x I2C
  • TPM 2.0
Battery
  • N/A
Power Input
  • ATX: +12V, +5VSB
  • AT: +12V
Watchdog Timer
  • 65536 levels, 0 to 65535 sec.
Hardware Monitoring
  • Yes
Operating Temperature
  • -40°C to +85°C (-40°F to +185°F) (operation with heatsink and fan)
Relative Humidity
  • 10% – 95% relative humidity, non-condensing
Vibration
  • 3.5 Grms
Dimensions
  • 125 x 95 mm
Board Thickness
  • 2.0 mm
Certifications
  • CE
Bestellinformationen
  • CEM520-E-2176M+CM246 (P/N-E38D520100)
  • COM Express Type 6 Basic module with Intel® Xeon® E-2176M, CM246, DDI/LVDS, GbE LAN, USB 3.0 and TPM
  • CEM520-i7-8850H+QM370 COM Express Type 6 Basic module with Intel® Core™ i7-8850H, QM370, DDI/LVDS, GbE LAN, USB 3.0 and TPM
  • CEM520-i5-8400H+QM370 COM Express Type 6 Basic module with Intel® Core™ i5-8400H, QM370, DDI/LVDS, GbE LAN, USB 3.0 and TPM
  • CEM520-i3-8100H+HM370 COM Express Type 6 Basic module with Intel® Core™ i3-8100H, HM370, DDI/LVDS, GbE LAN, USB 3.0 and TPM
  • CEB94011 (P/N-E394011100)
  • CEB94011 COM Express Type 6 evaluation board
  • CEM520 heat sink with fan
  • CEM520 heat spreader
Downloads
Datenblatt:
19.03.2020
PDF
165 KB
Features
  • Intel® Xeon® & 8th gen Intel® Core™ i7/i5/i3 Proczessoren (Coffee Lake)
  • Intel® CM246/QM370/HM370 Chipset
  • 2 DDR4-2666 SO-DIMM Slots für bis zu 32GB Speicher
  • 1 PCIe x16 und 8 PCIe x1 Gen3
  • 4 SATA-600 mit RAID 0/1/5/10
  • 4 USB 3.0 mit 8 USB 2.0
  • TPM 2.0 Funktion unterstützt
  • AMS.AXView intelligente Fernverwaltungssoftware für industrielle IoT-Anwendungen
Spezifikationen
CPU
  • Intel® Xeon® & 8th gen Intel® Core™ i7/i5/i3 processors (Coffee Lake)
Chipset
  • Intel® CM246/QM370/HM370
System Memory
  • 2 x DDR4-2666 SO-DIMM, up to 32GB non-ECC/ECC memory
BIOS
  • AMI
Serial
  • 1 x LPC
  • 1 x SPI
  • 2 x TX/RX
USB
  • 4 x USB 3.0
  • 8 x USB 2.0
Ethernet
  • 1 x 10/100/1000 Mbps (Intel® i219-LM)
Display
  • 1 x LVDS (optional eDP 1.4: 4096 x 2304 @60Hz)
  • 1 x VGA; up to 1920 x 1200 @60Hz (default)
  • 2 x DDI (DisplayPort 1.2: 4096 x 2304 @60Hz/HDMI 1.4: 4096 x 2160 @30/24Hz)
GPIO
  • 4-CH in & 4-CH out
Audio
  • HD link interface to baseboard for Codec
Storage
  • 4 x SATA-600 with RAID 0/1/5/10
Expansion
  • 1 x PCIe x16 Gen3
  • 8 x PCIe x1 Gen3
Others
  • 1 x I2C
  • TPM 2.0
Battery
  • N/A
Power Input
  • ATX: +12V, +5VSB
  • AT: +12V
Watchdog Timer
  • 65536 levels, 0 to 65535 sec.
Hardware Monitoring
  • Yes
Operating Temperature
  • -40°C to +85°C (-40°F to +185°F) (operation with heatsink and fan)
Relative Humidity
  • 10% – 95% relative humidity, non-condensing
Vibration
  • 3.5 Grms
Dimensions
  • 125 x 95 mm
Board Thickness
  • 2.0 mm
Certifications
  • CE
Bestellinformationen
  • CEM520-E-2176M+CM246 (P/N-E38D520100)
  • COM Express Type 6 Basic module with Intel® Xeon® E-2176M, CM246, DDI/LVDS, GbE LAN, USB 3.0 and TPM
  • CEM520-i7-8850H+QM370 COM Express Type 6 Basic module with Intel® Core™ i7-8850H, QM370, DDI/LVDS, GbE LAN, USB 3.0 and TPM
  • CEM520-i5-8400H+QM370 COM Express Type 6 Basic module with Intel® Core™ i5-8400H, QM370, DDI/LVDS, GbE LAN, USB 3.0 and TPM
  • CEM520-i3-8100H+HM370 COM Express Type 6 Basic module with Intel® Core™ i3-8100H, HM370, DDI/LVDS, GbE LAN, USB 3.0 and TPM
  • CEB94011 (P/N-E394011100)
  • CEB94011 COM Express Type 6 evaluation board
  • CEM520 heat sink with fan
  • CEM520 heat spreader
Download
Datenblatt:
PDF
165 KB

Passende Anwendungsbeispiele

Kiosksysteme (POS/POI)
Kiosksysteme (POS/POI)
Digital Signage in Schulen
Digital Signage in Schulen
Weitere Anwendungsbeispiele ansehen
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