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COM Express Compact Modul

 Apollo Lake

CEM312

  • COM Express Type 6 Compact Modul
  • Intel® Atom® x5 und x7 Prozessoren

Features
  • Intel® Atom® x5 und x7 Prozessoren (Apollo Lake)
  • 2 DDR3L-1600 SO-DIMM für bis zu 8GB Speicherplatz
  • bis zu 4PCI Express Bahnen
  • 2 SATA-600
  • 4 USB 3.0 und 8 USB 2.0
  • AXView 2.0 intelligente Remote Management Software
  • unterstützt TPM 1.2 (optional)
Spezifikationen
  • CPU Intel® Atom® x7-E3950 (2.0 GHz), Intel® Atom® x5-E3940 (1.8 GHz), Intel® Atom® x5-E3930 (1.8 GHz)
  • Chipset SoC integrated
  • System Memory 2 x 204-pin SO-DIMM DDR3L-1600, up to 8GB
  • BIOS AMI
  • COM 2 x TX/RX
  • USB 4 x USB 3.0,8 x USB 2.0
  • Ethernet 1 x 10/100/1000 Mbps (Intel® i210-IT)
  • Display 2 x DDI (DP, HDMI, DVI); VGA optional,1 x LVDS (eDP option)
  • GPIO 4-CH in & 4-CH out
  • Audio HD link interface to baseboard for Codec
  • Storage 2 x SATA-600,eMMC 5.0 64GB (optional)
  • Expansion 4 x PCIe (3 lanes while internal LAN is connected)
  • Others 1 x LPC,1 x SPI,TPM 1.2 (optional)
  • Battery N/A
  • Power Input ATX: 12V, +5VSB,AT: 12V
  • Watchdog Timer 65536 levels, 0 to 65535 sec.
  • Hardware Monitoring Yes
  • Operating Temperature -40°C to +85°C (-40°F to +185°F)
  • Relative Humidity 10% to 95% relative humidity, non-condensing
  • Dimensions 95 x 95 mm
  • Board Thickness 2.0 mm
  • Certifications CE
Bestellinformationen
  • CEM312PG-E3950 (P/N-E38D312100)

COM Express Type 6 Compact module with Intel® Atom® x7-E3950, DDI, LVDS, USB 3.0 and GbE LAN

  • CEM312PG-E3940 (P/N-E38D312101)

COM Express Type 6 Compact module with Intel® Atom® x5-E3940, DDI, LVDS, USB 3.0 and GbE LAN

  • CEM312PG-E3930 (P/N-E38D312103)

COM Express Type 6 Compact module with Intel® Atom® x5-E3930, DDI, LVDS, USB 3.0 and GbE LAN

  • CEB94011 (P/N-E394011100)

COM Express Type 6 evaluation board

  • 7128D312000E

CEM312 heatspreader

  • 7118D312000E

CEM312 heatshink

 

Downloads
10.01.2019
PDF
07.05.2019
PDF
07.05.2019
PDF
26.06.2019
PDF
Features
  • Intel® Atom® x5 und x7 Prozessoren (Apollo Lake)
  • 2 DDR3L-1600 SO-DIMM für bis zu 8GB Speicherplatz
  • bis zu 4PCI Express Bahnen
  • 2 SATA-600
  • 4 USB 3.0 und 8 USB 2.0
  • AXView 2.0 intelligente Remote Management Software
  • unterstützt TPM 1.2 (optional)
Spezifikationen
  • CPU Intel® Atom® x7-E3950 (2.0 GHz), Intel® Atom® x5-E3940 (1.8 GHz), Intel® Atom® x5-E3930 (1.8 GHz)
  • Chipset SoC integrated
  • System Memory 2 x 204-pin SO-DIMM DDR3L-1600, up to 8GB
  • BIOS AMI
  • COM 2 x TX/RX
  • USB 4 x USB 3.0,8 x USB 2.0
  • Ethernet 1 x 10/100/1000 Mbps (Intel® i210-IT)
  • Display 2 x DDI (DP, HDMI, DVI); VGA optional,1 x LVDS (eDP option)
  • GPIO 4-CH in & 4-CH out
  • Audio HD link interface to baseboard for Codec
  • Storage 2 x SATA-600,eMMC 5.0 64GB (optional)
  • Expansion 4 x PCIe (3 lanes while internal LAN is connected)
  • Others 1 x LPC,1 x SPI,TPM 1.2 (optional)
  • Battery N/A
  • Power Input ATX: 12V, +5VSB,AT: 12V
  • Watchdog Timer 65536 levels, 0 to 65535 sec.
  • Hardware Monitoring Yes
  • Operating Temperature -40°C to +85°C (-40°F to +185°F)
  • Relative Humidity 10% to 95% relative humidity, non-condensing
  • Dimensions 95 x 95 mm
  • Board Thickness 2.0 mm
  • Certifications CE
Bestellinformationen
  • CEM312PG-E3950 (P/N-E38D312100)

COM Express Type 6 Compact module with Intel® Atom® x7-E3950, DDI, LVDS, USB 3.0 and GbE LAN

  • CEM312PG-E3940 (P/N-E38D312101)

COM Express Type 6 Compact module with Intel® Atom® x5-E3940, DDI, LVDS, USB 3.0 and GbE LAN

  • CEM312PG-E3930 (P/N-E38D312103)

COM Express Type 6 Compact module with Intel® Atom® x5-E3930, DDI, LVDS, USB 3.0 and GbE LAN

  • CEB94011 (P/N-E394011100)

COM Express Type 6 evaluation board

  • 7128D312000E

CEM312 heatspreader

  • 7118D312000E

CEM312 heatshink

 

Download
Datenblatt:
PDF
CE-Manual:
PDF
Quick Manual:
PDF
User Manual:
PDF

Passende Anwendungsbeispiele

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