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3.5-inch Embedded Board

CAPA500

  • 3.5″ Embedded SBC with LGA1151 Socket 6th/7th Gen Intel® Core™ i7/i5/i3 Processor
  • LVDS/ VGA/HDMI
  • Dual LANs and Audio

Features
  • LGA1151 6th/7th gen Intel® Core™ i7/i5/i3 processor (Skylake/Kaby Lake)
  • Intel® H110 chipset (Q170 optional)
  • 1 DDR4-1867 SO-DIMM, up to 16GB
  • 3 USB 3.0 and 3 USB 2.0 ports
  • 1 COM port
  • Intel® AMT 11 supported (optional)
Spezifikationen
  • CPU LGA1151 7th/6th generation Intel® Core™ i7/i5/i3 processor (TDP up to 35W)
  • Chipset Intel® H110 Intel® Q170 (optional)
  • System Memory 1 x 260-pin SO-DIMM DDR4-1867, up to 16GB
  • BIOS AMI
  • COM 1 x RS-232/422/485; with +5V/+12V powered
  • USB 3 x USB 3.0, 3 x USB 2.0
  • Ethernet 1 x 10/100/1000 Mbps (Intel® i211AT), 1 x 10/100/1000 Mbps (Intel® i219LM)
  • Display 1 x VGA, 1 x LVDS, 1 x HDMI
  • Digital I/O 8 channels IN/OUT programmed
  • Audio MIC-in/Line-in/Line-out
  • Storage 1 x SATA-600
  • Expansion 1 x Full-size PCI Express Mini Card slot with mSATA supported, 1 x USB, 1 x PCIe x1, 1 x LPC, 1 x SMBus through a ZIO connector (optional)
  • Others Intel ® AMT 11 (optional), SMBus
  • Battery Lithium 3V/220mAH
  • Power Input 2 x 2-pin connector, +12V DC-in only, AT Auto Power On function supported
  • Power Requirements TBD
  • Watchdog Timer 255 levels, 1 ~ 255 sec.
  • Hardware Monitoring Yes
  • Operating Temperature -20°C ~ +60°C (-4°F ~ +140°F)
  • Relative Humidity 10% ~ 95% relative humidity, non-condensing
  • Dimensions 146 x 104 mm
  • Board Thickness 1.6 mm
  • Certifications CE

 

Bestellinformationen
  • CAPA500VHGGA-H110 (P/N-E38E500103)

3.5″ embedded SBC with LGA1151 socket 6th/7th generation Intel® Core™ i7/i5/i3 processor, Intel® H110 chipset, VGA/LVDS/HDMI, 2 GbE LANs, audio and gift box

  • CAPA500VHGGA-Q170 (P/N-E38E500102)

3.5″ embedded SBC with LGA1151 socket 6th/7th generation Intel® Core™ i7/i5/i3 processor, Intel® Q170 chipset, VGA/LVDS/HDMI, 2 GbE LANs, audio and gift box

  • CAPA500VHGGA-H110-ZI0 (P/N- E38E500101)

3.5″ embedded SBC with LGA1151 socket 6th/7th generation Intel® Core™ i7/i5/i3 processor, Intel® H110 chipset, VGA/LVDS/HDMI, 2 GbE LANs, audio and ZIO connector

  • CAPA500VHGGA-Q170-ZI0 (P/N-E38E500100)

3.5″ embedded SBC with LGA1151 socket 6th/7th generation Intel® Core™ i7/i5/i3 processor, Intel® Q170 chipset, VGA/LVDS/HDMI, 2 GbE LANs, audio and ZIO connector

  • AX93262 (P/N-E393262100)

ZIO module for 2 x RS-232/422/485, 2 x RS-232, 1 x PCI Express Mini Card slot

  • AX93285 (P/N-E393285100)

ZIO module for 2 x RS-232, 32-bit programmable DIO

  • AX93291 (P/N-E393291100)

ZIO module for 2 x RS-232, 2 x GbE LAN

  • AX93295 (P/N-E393295100)

ZIO module for 2 x isolated RS-232, 2 x USB 3.0

 

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Datenblatt:
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Zugehörige Produkte
Features
  • LGA1151 6th/7th gen Intel® Core™ i7/i5/i3 processor (Skylake/Kaby Lake)
  • Intel® H110 chipset (Q170 optional)
  • 1 DDR4-1867 SO-DIMM, up to 16GB
  • 3 USB 3.0 and 3 USB 2.0 ports
  • 1 COM port
  • Intel® AMT 11 supported (optional)
Spezifikationen
  • CPU LGA1151 7th/6th generation Intel® Core™ i7/i5/i3 processor (TDP up to 35W)
  • Chipset Intel® H110 Intel® Q170 (optional)
  • System Memory 1 x 260-pin SO-DIMM DDR4-1867, up to 16GB
  • BIOS AMI
  • COM 1 x RS-232/422/485; with +5V/+12V powered
  • USB 3 x USB 3.0, 3 x USB 2.0
  • Ethernet 1 x 10/100/1000 Mbps (Intel® i211AT), 1 x 10/100/1000 Mbps (Intel® i219LM)
  • Display 1 x VGA, 1 x LVDS, 1 x HDMI
  • Digital I/O 8 channels IN/OUT programmed
  • Audio MIC-in/Line-in/Line-out
  • Storage 1 x SATA-600
  • Expansion 1 x Full-size PCI Express Mini Card slot with mSATA supported, 1 x USB, 1 x PCIe x1, 1 x LPC, 1 x SMBus through a ZIO connector (optional)
  • Others Intel ® AMT 11 (optional), SMBus
  • Battery Lithium 3V/220mAH
  • Power Input 2 x 2-pin connector, +12V DC-in only, AT Auto Power On function supported
  • Power Requirements TBD
  • Watchdog Timer 255 levels, 1 ~ 255 sec.
  • Hardware Monitoring Yes
  • Operating Temperature -20°C ~ +60°C (-4°F ~ +140°F)
  • Relative Humidity 10% ~ 95% relative humidity, non-condensing
  • Dimensions 146 x 104 mm
  • Board Thickness 1.6 mm
  • Certifications CE

 

Bestellinformationen
  • CAPA500VHGGA-H110 (P/N-E38E500103)

3.5″ embedded SBC with LGA1151 socket 6th/7th generation Intel® Core™ i7/i5/i3 processor, Intel® H110 chipset, VGA/LVDS/HDMI, 2 GbE LANs, audio and gift box

  • CAPA500VHGGA-Q170 (P/N-E38E500102)

3.5″ embedded SBC with LGA1151 socket 6th/7th generation Intel® Core™ i7/i5/i3 processor, Intel® Q170 chipset, VGA/LVDS/HDMI, 2 GbE LANs, audio and gift box

  • CAPA500VHGGA-H110-ZI0 (P/N- E38E500101)

3.5″ embedded SBC with LGA1151 socket 6th/7th generation Intel® Core™ i7/i5/i3 processor, Intel® H110 chipset, VGA/LVDS/HDMI, 2 GbE LANs, audio and ZIO connector

  • CAPA500VHGGA-Q170-ZI0 (P/N-E38E500100)

3.5″ embedded SBC with LGA1151 socket 6th/7th generation Intel® Core™ i7/i5/i3 processor, Intel® Q170 chipset, VGA/LVDS/HDMI, 2 GbE LANs, audio and ZIO connector

  • AX93262 (P/N-E393262100)

ZIO module for 2 x RS-232/422/485, 2 x RS-232, 1 x PCI Express Mini Card slot

  • AX93285 (P/N-E393285100)

ZIO module for 2 x RS-232, 32-bit programmable DIO

  • AX93291 (P/N-E393291100)

ZIO module for 2 x RS-232, 2 x GbE LAN

  • AX93295 (P/N-E393295100)

ZIO module for 2 x isolated RS-232, 2 x USB 3.0

 

Passende Anwendungsbeispiele

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